Hoʻopili pinepine ʻia ka chemical-mechanical polishing (CMP) me ka hana ʻana i nā ʻili maʻemaʻe e ka hopena kemika, ʻoi aku ka hana ma ka ʻoihana hana semiconductor.Lonnmeter, he mea hana hou hilinaʻi me ka ʻoi aku o 20 mau makahiki o ka ʻike ma ke ana ʻana i ka inline, hāʻawi ʻo ia i ka mea hou.ʻaʻole-nuclear density mikaa me nā mea ʻike viscosity e hoʻoponopono i nā pilikia o ka hoʻokele slurry.
ʻO ke koʻikoʻi o ka maikaʻi o ka Slurry a me ka ʻike Lonnmeter
ʻO ka chemical polishing slurry ka iwi kuamoʻo o ke kaʻina hana CMP, e hoʻoholo ana i ka kūlike a me ka maikaʻi o nā papa. Hiki i ka slurry density like ʻole a i ʻole viscosity ke alakaʻi i nā pōʻino e like me ka micro-scratches, ka wehe ʻole ʻana o nā mea, a i ʻole ka paʻa ʻana o ka pad, e hōʻemi ana i ka maikaʻi o ka wafer a me ka hoʻonui ʻana i nā kumukūʻai. ʻO Lonnmeter, he alakaʻi honua i nā ʻenehana ana ʻenehana, loea i ke ana slurry inline e hōʻoia i ka hana slurry maikaʻi loa. Me kahi moʻolelo i hōʻoia ʻia o ka hāʻawi ʻana i nā mea ʻike hilinaʻi kiʻekiʻe, ua hui pū ʻo Lonnmeter me nā mea hana semiconductor alakaʻi e hoʻomaikaʻi i ka mana kaʻina hana a me ka pono. Hāʻawi kā lākou non-nuclear slurry density meter a me viscosity sensor i ka ʻikepili i ka manawa maoli, e hiki ai i nā hoʻoponopono pololei ke mālama i ka slurry a hoʻokō i nā koi ikaika o ka hana semiconductor hou.
ʻOi aku ma mua o ʻelua mau makahiki o ka ʻike i ke ana ʻana o ka inline, i hilinaʻi ʻia e nā ʻoihana semiconductor kiʻekiʻe. Hoʻolālā ʻia nā mea ʻike Lonnmeter no ka hoʻohui pono ʻana a me ka mālama ʻole ʻana, e hōʻemi ana i nā koina hana.
ʻO ke kuleana o ka hoʻolele ʻana i nā mīkini mekini ma ka hana semiconductor
ʻO ka chemical mechanical polishing (CMP), i kapa ʻia ʻo ka planarization chemical-mechanical, he pōhaku kihi o ka hana semiconductor, e hiki ai ke hana i nā papa pālahalaha, kīnā ʻole no ka hana ʻana i ka chip holomua. Ma ka hoʻohui ʻana i ka etching kemika me ka mechanical abrasion, ʻo ke kaʻina hana CMP e hōʻoia i ka pololei e koi ʻia no nā kaapuni hoʻohui ʻia he nui ma nā nodes ma lalo o 10nm. ʻO ka slurry polishing mechanical, i haku ʻia me ka wai, nā reagents kemika, a me nā ʻāpana abrasive, e launa pū me ka papa polishing a me ka wafer e hoʻoneʻe like i nā mea. Ke ulu nei nā hoʻolālā semiconductor, ʻoi aku ka paʻakikī o ke kaʻina CMP, e koi ana i ka hoʻomalu paʻa ʻana i nā waiwai slurry e pale aku ai i nā hemahema a loaʻa i nā wafers i hoʻomaʻemaʻe ʻia i koi ʻia e Semiconductor Foundries a me nā Mea Hoʻolako Mea.
Pono ke kaʻina hana no ka hana ʻana i nā ʻāpana 5nm a me 3nm me nā hemahema liʻiliʻi, e hōʻoiaʻiʻo ana i nā papa pālahalaha no ka waiho pololei ʻana o nā papa ma hope. Hiki i nā ʻokoʻa liʻiliʻi liʻiliʻi ke alakaʻi i ka hana hou ʻana a i ʻole nā pohō.
ʻO nā pilikia i ka nānā ʻana i nā waiwai Slurry
ʻO ka mālama mau ʻana i ka slurry density a me ka viscosity i loko o ke kaʻina hana polishing chemical me nā pilikia. Hiki ke ʻokoʻa nā waiwai slurry ma muli o nā kumu e like me ka lawe ʻana, dilution me ka wai a i ʻole hydrogen peroxide, kūpono ʻole ka hui ʻana, a i ʻole ka hoʻohaʻahaʻa kemika. No ka laʻana, hiki i ka hoʻopaʻa ʻana i nā ʻāpana slurry ke hoʻonui i ke kiʻekiʻe ma lalo, e alakaʻi ana i ka poli like ʻole. ʻAʻole lawa nā ʻano nānā kuʻuna e like me pH, oxidation-reduction potential (ORP), a i ʻole conductivity, no ka mea, ʻaʻole lākou e ʻike i nā loli liʻiliʻi o ka haku mele. Hiki i kēia mau palena ke hopena i nā hemahema, hoʻemi ʻia ka nui o ka wehe ʻana, a me ka hoʻonui ʻana i nā kumukūʻai hoʻopau ʻia, e waiho ana i nā pilikia nui no nā mea hana semiconductor a me nā mea lawelawe CMP. Hoʻololi nā hoʻololi i ka wā o ka lawelawe ʻana a me ka hāʻawi ʻana i ka hana. Pono nā pūnae sub-10nm i ka mana paʻa ma luna o ka maʻemaʻe slurry a me ka hoʻohui pono ʻana. Hōʻike ka pH a me ka ORP i ka liʻiliʻi liʻiliʻi, ʻoiai ke ʻano o ka conductivity me ka slurry aging. Hiki i nā waiwai slurry like ʻole ke hoʻonui i ka helu defect a hiki i ka 20%, no kēlā me kēia noiʻi ʻoihana.
Na Lonnmeter's Inline Sensors for Real-Time Monitoring
Hoʻopuka ʻo Lonnmeter i kēia mau pilikia me kāna mau mika slurry slurry kiʻekiʻe a menā mea ʻike viscosity, me ka viscosity mika inline no ka laina viscosity ana a me ka ultrasonic density mika no ka manawa like slurry density a me ka viscosity nānā. Hoʻolālā ʻia kēia mau mea ʻike no ka hoʻohui pono ʻana i nā kaʻina CMP, e hōʻike ana i nā pilina maʻamau o ka ʻoihana. Hāʻawi nā hāʻina o Lonnmeter i ka hilinaʻi lōʻihi a me ka mālama haʻahaʻa no kāna kūkulu paʻa. Hiki i ka ʻikepili i ka manawa maoli ke hiki i nā mea hoʻohana ke hoʻoponopono maikaʻi i ka hui ʻana o ka slurry, pale i nā hemahema, a me ka hoʻomaikaʻi ʻana i ka hana polishing, e hana pono ai kēia mau mea hana no nā mea hoʻolako ʻana a me nā lako hoʻāʻo a me nā mea hoʻolako CMP Consumables.
Nā pōmaikaʻi o ka nānā mau ʻana no ka CMP Optimization
Ke hoʻomau nei ka nānā ʻana me ka Lonnmeter inline sensor e hoʻololi i ke kaʻina hana polishing chemical ma o ka hāʻawi ʻana i nā ʻike hiki ke hana a me ka mālama kālā nui. ʻO ke ana ʻana o ka slurry density manawa maoli a me ka nānā ʻana i ka viscosity e hōʻemi i nā hemahema e like me nā ʻōpala a i ʻole ka hoʻomaʻamaʻa ʻana a hiki i ka 20%, e like me nā benchmarks. ʻO ka hoʻohui ʻana me ka ʻōnaehana PLC e hiki ai i ka dosing automated a me ka mana kaʻina hana, e hōʻoia ana i ka noho ʻana o nā waiwai slurry i loko o nā pae kūpono. Ke alakaʻi nei kēia i kahi hōʻemi 15-25% i nā kumukūʻai consumable, hoʻemi ʻia ka downtime, a hoʻomaikaʻi i ka like ʻana o ka wafer. No Semiconductor Foundries a me CMP Services Providers, ua unuhi kēia mau pōmaikaʻi i ka hoʻonui ʻana i ka huahana, ʻoi aku ka nui o ka loaʻa kālā, a me ka hoʻokō ʻana i nā kūlana e like me ISO 6976.
Nā nīnau maʻamau e pili ana i ka nānā ʻana i ka Slurry ma CMP
No ke aha e pono ai ke ana slurry density no CMP?
ʻO ke ana ʻana o ka slurry e hōʻoiaʻiʻo i ka hāʻawi ʻana i nā ʻāpana like ʻole a me ka hoʻohui ʻana i ke kūlike, ka pale ʻana i nā hemahema a me ka hoʻomaikaʻi ʻana i nā helu hoʻoneʻe ʻana i ke kaʻina hana polishing chemical. Kākoʻo ia i ka hana wafer kiʻekiʻe a me ka hoʻokō ʻana i nā kūlana ʻoihana.
Pehea e hoʻonui ai ka nānā ʻana i ka viscosity i ka pono CMP?
Mālama ka nānā ʻana i ka viscosity i ka kahe ʻana o ka slurry, pale i nā pilikia e like me ka paʻa ʻana o ka papa a i ʻole ka poli ʻole. Hāʻawi nā mea ʻike inline o Lonnmeter i ka ʻikepili manawa maoli e hoʻomaikaʻi i ke kaʻina CMP a hoʻomaikaʻi i nā hua wafer.
He aha ka mea e kū hoʻokahi ai nā mika slurry slurry ʻole o Lonnmeter?
Hāʻawi ka Lonnmeter non-nuclear slurry density mika i ka manawa like a me nā ana viscosity me ka pololei kiʻekiʻe a me ka mālama ʻole. ʻO kā lākou hoʻolālā koʻikoʻi e hōʻoia i ka hilinaʻi i ke koi ʻana i nā kaʻina hana CMP.
He mea koʻikoʻi ke ana ʻana o ka slurry density manawa maoli a me ka nānā ʻana i ka viscosity no ka hoʻomaikaʻi ʻana i ke kaʻina hana polishing kemika i ka hana semiconductor. Hāʻawi nā Lonnmeter non-nuclear slurry density mika a me nā mea ʻike viscosity i nā mea hana Semiconductor Equipment Manufacturers, CMP Consumables Suppliers, a me Semiconductor Foundries me nā mea hana e lanakila ai i nā pilikia hoʻokele slurry, e hōʻemi i nā hemahema, a me nā kumukūʻai haʻahaʻa. Ma ka hāʻawi ʻana i ka ʻikepili pololei a me ka manawa maoli, hoʻomaikaʻi kēia mau hoʻonā i ke kaʻina hana, hōʻoia i ka hoʻokō ʻana, a hoʻokele waiwai i ka mākeke CMP hoʻokūkū. KipaKa punaewele o Lonnmetera i ʻole e kelepona i kā lākou hui i kēia lā e ʻike pehea e hiki ai i ka Lonnmeter ke hoʻololi i kāu mau hana polishing mechanical.
Ka manawa hoʻouna: Iulai-22-2025
